Eldaas Technologies Inc, a leading embedded design services company specializing in industrial solutions tied a partnership with Mediatek to bring up Rich IoT solutions with integrated AI.
Eldaas Technologies Inc, specializing in ARM core embedded board solutions is working with Mediatek on one of their latest processor platforms to bring up an IoT solutions with AI engine and edge computing capability.
Eldaas has full potential of providing custom solutions using this platform in the areas of hardware, software driver development, Artificial Intelligence, Machine learning applications and mass volume manufacturing.
Eldaas may remain as a single point contact for customers across the globe and Mediatek advantage will help customers on cost effective yet powerful & intelligent solutions in industrial solutions.
Raleigh, NC, USA / Bangalore, India – Aug 04th, 2020
Eldaas Technologies Inc, a leading embedded design services company specializing in industrial solutions tied a partnership with Mediatek to bring up Rich IoT solutions with integrated AI.
Eldaas Technologies Inc, specializing in ARM core embedded board solutions is working with Mediatek on one of their latest processor platforms to bring up an IoT solutions with AI engine and edge computing capability.
Eldaas has full potential of providing custom solutions using this platform in the areas of hardware, software driver development, Artificial Intelligence, Machine learning applications and mass volume manufacturing.
Eldaas may remain as a single point contact for customers across the globe and Mediatek advantage will help customers on cost effective yet powerful & intelligent solutions in industrial solutions.
About Mediatek Inc
MediaTek is the world’s 4th largest global fabless semiconductor company and powers more than 1.5 billion devices a year.
MediaTek’s AIoT program is spurring AI innovation with its platforms that enterprises, startups, emerging brands and leading OEMs in diverse markets use; designing a wide range of IoT devices with Edge-AI capabilities, new user experiences and addressing new market opportunities. The AIoT program enables adopting customers to deep-differentiate in software and going to market quickly. The offering includes MediaTek hardware solutions, running Linux or Android software builds.
We have targeted to release the product in September 2020. Read more for latest updates.
Eldaas Technologies India Pvt Ltd announces their distribution partnership on security & surveillance solutions with D-Fence Electronic Fencing and Security Systems Ltd, Israel.
In today’s scenario camera-based security alone is not enough to detect intruders or prevent them from entering. We need a stronger and proven solution which can’t be cracked down by any person.
Our partner D-Fence solutions based out of Israel, spent many years on studying & researching in this field. They have developed a variety of perimeter security solutions using cutting edge technology which can meet the need of a private property to a large defense establishment.
Eldaas Technologies, an expert embedded solutions provider for defense & Aerospace, Automotive and Industrial Embedded partnering with D-Fence in solutioning to various customers in India.
The available solutions are from footstep detection to an electronic fencing with a combination of camera and various sensors for accurate identification and differentiation between animals and human.
“We believe that our partnership with D-Fence, will enable us to serve our customers with value added solutions in the Defence and security domain” says Co-founder & CEO Mr. Suneel Kumar.
“We are happy to appoint Eldaas Technologies as our Authorized Representative in India. By entering this relationship, we anticipate an exponential growth for us in this region” says, D-Fence solutions, Israel.
In today’s scenario camera-based security alone is not enough to detect intruders or prevent them from entering. We need a stronger and proven solution which can’t be cracked down by any person.
Our partner D-Fence solutions based out of Israel, spent many years on studying & researching in this field. They have developed a variety of perimeter security solutions using cutting edge technology which can meet the need of a private property to a large defense establishment. Read More
Eldaas is celebrating its 10th Anniversary, starting from May 10, 2020. At this time we would like to extend our heart felt thanks to all our customers, employees, vendors and other partners. Without them it wouldn’t be possible to run business successfully all these years. Read More
Objective of this article is to summarize the concept of Environmental Stress Screening (ESS), its benefits, process and applicability for various stages in the manufacture of Electronic Equipment.
2. Environmental Stress Screening:
Environmental Stress Screening (ESS) is a means of screening electronic assembly’s at the most cost effective point of manufacture to expose defects that can’t be detected by visual inspection or electrical testing. These defects are typically related to defective parts or workmanship and are normally found as early field failures. ESS works by subjecting 100% of a group of products to an environmental stimulus or a set of stimuli for a predetermined time for the purpose of forcing failures to occur before shipment, in fact, at the board level. Failures are normal and expected when ESS is applied. This makes ESS radically different than more conventional certification testing which requires failure free operation as proof of reliability. ESS is not a test, it is a process
Key factors for proper ESS implementation are:
The stress environment must not exceed the electrical or mechanical limits of the product.
An optimum level of stress must be applied to the product.
Expected benefits:
Reduced field repair expense
Fewer defects and waste
Elimination of less effective screening procedures
Lower unit cost
Increased product value
Improved customer satisfaction
Better return on investment (ROI)
Test Flow Chart
ESS may be conducted at any point in the manufacturing flow. It may be applied at more than one point, if justified. For electronic products, the three most common points are at the
Component level,
Sub-assembly level (circuit card level) and
Final assembly level.
Because the types of defects are different at each level, the stress conditions may be different at each level.
Following are the screening test will be carried out at different stages of product life cycle.
Component
Sub-assembly
Assembly/Subsystem
System
Temperature-Power Off
Temp.Cycling-Power Off
Temp.Cycling-Power On
Burn-In:Power On(Dynamic)
Temp.Cycling-Power Off
Vibration- Power Off
Vibration-Power On
–
Temperature-humidity-bias
–
–
–
ESS is product-specific, since each product has its own set of potential defects, and since the applied ESS stresses affect each product differently. Even though the ESS process must be set up separately for each product, there are many common features of both products and stresses which cause many ESS processes to be similar.
The stresses applied in ESS are those which are expected to precipitate manufacturing defects. They are not necessarily those which the product will see in service. The two most common ESS stresses for electronic products are temperature cycling and vibration. They may be applied sequentially or simultaneously. ESS may be conducted anywhere in the manufacturing process flow.
Types of Failures Detectable By Thermal & Vibration Environments:
Parameter
Thermal
Vibration
Wrong Component
yes
–
Parameter drift
yes
yes
Defective Solder Joint
yes
yes
Loose Hardware
–
yes
Broken Partially (Component/Lead)
yes
yes
Improper Crimp
yes
yes
Pinched Wires
–
yes
3. Test to Be Performed on PCBA & Module
S.No.
Test Type
STD
Test Type
Defense Based Equipment’s Test Conditions
Naval Based Equipment’s Test Conditions
Remark
1
ESS- PCB Level
CemilacStd
Temperature Soaking
High Temperature Soaking: +85 degC for 24 Hrs (OFF State Passive Test)
Passive testing
2
Thermal Shock
0- 50 degree C, 60 min (for commercial grade components) -40 to 70 degree C, 60 min (for MIL components) Change over time- 03 Min No. of cycle-06 (IS 9000, DEF 133, MIL 810 & JSS 50101)
For PCBs -40°C……60 minutes +70°C……60 minutes Change over to take place within 03 minutes. Number of cycles 06. Note: Care to be taken while handling PCBs with ESD devices
Tests shall be performed in powered OFF state. After the temperature cycling, functionality test shall be carried out.
3
Vibration Test
Random Vibration 20-2000 Hz, Power density 0.02 gsq/Hz in at least two axis
Random Vibration: 20 – 2000Hz, 0.02g2/Hz in X, Y axes, for 10 minutes in each axis
Defence: Passive testing Navel: Active Testing
4
Endurance
168 hrs at room temperature for sonars, communication equipment AIO systems, NAV aid equipment etc. and 08 hrs for radar equipment with 04 hrs ON
The equipment/ system is to be subjected to endurance test post FATS
5
Hemi sealing of PCBs
Conformal coating and Solder marking for all PCBs
1
ESS-Module Level
MIL-STD-2164
Burn In
48 Hrs at 60 deg C (highest operating temperature) (ON State Active Test with functional performance monitoring every 3 / 6 Hrs)
Active testing
2
Pre-Vibration Test
Pre Thermal (Initial) Vibration: 0.04g2/Hz for 5 minute in each of the 3 axes
Active testing
3
Thermal Cycle
a) Temperature Range: (-) 30 deg C to (+)70 deg C b) No. of Test Cycles: 10 c) Dwell time: 3 Hours and 20 Minutes d) Rate of Temperature Change: 5 deg C per minute e) Total Test Duration: 33.5 Hours
Active testing
4
Thermal Shock
–
For PCBs -40°C……60 minutes +70°C……60 minutes Change over to take place within 03 minutes. Number of cycles 06. Note: Care to be taken while handling PCBs with ESD devices
Active testing
5
Vibration Test
Random Vibration: 20 – 2000Hz, 0.02g2/Hz in X, Y axes, for 10 minutes in each axis in each axis
6
Post-Vibration Test
Post Thermal (Final) Vibration: 0.04g2/Hz for 5 minute in each of the 3 axes
Active testing
7
Endurance
168hrs at room temperature for sonars, communication equipment AIO systems, NAV aid equipment etc. and 08 hrs for radar equipment with 04 hrs ON
The equipment/ system is to be subjected to endurance test post FATS
4. Summary
ESS is a process to expose defective components and workmanship defects at the manufacturing stage and avoid their occurrence in early life of the product in the field. Though they look similar to environmental tests, they are not environmental tests which are carried out to bring out the defects due to design and engineering.
Eldaas has reopened its office today (4th May 2020) after lockdown, complying to the Government advised protocol. around 50% staff are attending office, while rest are supporting operations from home.
IMS2020 in Los Angeles, CA (04-06 Aug 2020), is world’s largest microwave and RF industry trade show, plus technical sessions, workshops and panel sessions, MicroApps sessions, and the Industry Workshops.
Meet with us at for interactive sessions with expert engineers, and to review our latest offerings, or discuss an upcoming project.
Our employees have contributed one day’s salary to the relief fund announced by our Prime Minister to help fight the coronavirus outbreak in the country.
Eldaas proudly announces their partnership renewal with xilinx. Eldaas assures that their contribution on FPGA based solutions are increasing in the recent past and it will be more in the future years. This partnership will play a key role in their future achievements too. Read more
Written by eldaasAugust 4, 2020 
