Eldaas announces their distribution partnership on security & surveillance solutions with D-Fence

In today’s scenario camera-based security alone is not enough to detect intruders or prevent them from entering. We need a stronger and proven solution which can’t be cracked down by any person.

Our partner D-Fence solutions based out of Israel, spent many years on studying & researching in this field. They have developed a variety of perimeter security solutions using cutting edge technology which can meet the need of a private property to a large defense establishment. Read More

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Eldaas stepping into 10th year by MAY 2020

Eldaas is celebrating its 10th Anniversary, starting from May 10, 2020. At this time we would like to extend our heart felt thanks to all our customers, employees, vendors and other partners. Without them it wouldn’t be possible to run business successfully all these years. Read More

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ENVIRONMENTAL STRESS SCREENING

Reduced Cost – Increased Profitability – Satisfied Customers

1.     Objective:

Objective of this article is to summarize the concept of Environmental Stress Screening (ESS), its benefits, process and applicability for various stages in the manufacture of Electronic Equipment.

2.     Environmental Stress Screening:

Environmental Stress Screening (ESS) is a means of screening electronic   assembly’s at the most cost effective point of manufacture to expose defects that can’t be detected by visual inspection or electrical testing. These defects are typically related to defective parts or workmanship and are normally found as early field failures. ESS works by subjecting 100% of a group of products to an environmental stimulus or a set of stimuli for a predetermined time for the purpose of forcing failures to occur before shipment, in fact, at the board level. Failures are normal and expected when ESS is applied. This makes ESS radically different than more conventional certification testing which requires failure free operation as proof of reliability. ESS is not a test, it is a process

Key factors for proper ESS implementation are:

  1. The stress environment must not exceed the electrical or mechanical limits of the product.
  2. An optimum level of stress must be applied to the product.

Expected benefits:

  1. Reduced field repair expense
  2. Fewer defects and waste
  3. Elimination of less effective screening procedures
  4. Lower unit cost
  5. Increased product value
  6. Improved customer satisfaction
  7. Better return on investment (ROI)

Test Flow Chart

ESS may be conducted at any point in the manufacturing flow. It may be applied at more than one point, if justified. For electronic products, the three most common points are at the

  1. Component level,
  2. Sub-assembly level (circuit card level) and
  3. Final assembly level.

Because the types of defects are different at each level, the stress conditions may be different at each level.

Following are the screening test will be carried out at different stages of product life cycle.

ComponentSub-assemblyAssembly/SubsystemSystem
Temperature-Power OffTemp.Cycling-Power OffTemp.Cycling-Power OnBurn-In:Power On(Dynamic)
Temp.Cycling-Power OffVibration- Power OffVibration-Power On
Temperature-humidity-bias

ESS is product-specific, since each product has its own set of potential defects, and since the applied ESS stresses affect each product differently. Even though the ESS process must be set up separately for each product, there are many common features of both products and stresses which cause many ESS processes to be similar.

The stresses applied in ESS are those which are expected to precipitate manufacturing defects. They are not necessarily those which the product will see in service. The two most common ESS stresses for electronic products are temperature cycling and vibration. They may be applied sequentially or simultaneously. ESS may be conducted anywhere in the manufacturing process flow.

Types of Failures Detectable By Thermal & Vibration Environments:

ParameterThermalVibration
Wrong Componentyes
Parameter driftyesyes
Defective Solder Jointyesyes
Loose Hardwareyes
Broken Partially (Component/Lead)yesyes
Improper Crimpyesyes
Pinched Wiresyes

3.     Test to Be Performed on PCBA & Module

S.No. Test Type STD Test Type Defense Based Equipment’s  Test Conditions Naval Based Equipment’s  Test Conditions Remark
1 ESS- PCB Level CemilacStd Temperature Soaking High Temperature Soaking: +85 degC for 24 Hrs  (OFF State Passive Test)   Passive testing
2 Thermal Shock 0- 50 degree C, 60 min (for commercial grade components) -40 to 70 degree C, 60 min (for MIL components) Change over time- 03 Min No. of cycle-06 (IS 9000, DEF 133, MIL 810 & JSS 50101) For PCBs -40°C……60 minutes +70°C……60 minutes Change over to take place within 03 minutes. Number of cycles 06. Note: Care to be taken while handling PCBs with ESD devices Tests shall be performed in powered OFF state. After the temperature cycling, functionality test shall be carried out.
3 Vibration Test Random Vibration 20-2000 Hz, Power density 0.02 gsq/Hz in at least two axis Random Vibration: 20 – 2000Hz, 0.02g2/Hz in X, Y axes, for 10 minutes in each axis Defence: Passive testing Navel: Active Testing
4 Endurance 168 hrs at room temperature for sonars, communication equipment AIO systems, NAV aid equipment etc. and 08 hrs for radar equipment with 04 hrs ON The equipment/ system is to be subjected to endurance test post FATS  
5 Hemi sealing of PCBs Conformal coating and Solder marking for all PCBs    
1 ESS-Module Level MIL-STD-2164 Burn In 48 Hrs at 60 deg C (highest operating temperature)  (ON State Active Test with functional performance monitoring every 3 / 6 Hrs)   Active testing
2 Pre-Vibration Test Pre Thermal (Initial) Vibration: 0.04g2/Hz for 5 minute in each of the 3 axes   Active testing
3 Thermal Cycle a) Temperature Range:  (-) 30 deg C to (+)70 deg C b) No. of Test Cycles: 10 c) Dwell time: 3 Hours and 20 Minutes d) Rate of Temperature Change: 5 deg C per minute e) Total Test Duration: 33.5 Hours   Active testing
4 Thermal Shock For PCBs -40°C……60 minutes +70°C……60 minutes Change over to take place within 03 minutes. Number of cycles 06. Note: Care to be taken while handling PCBs with ESD devices Active testing
5 Vibration Test   Random Vibration: 20 – 2000Hz, 0.02g2/Hz in X, Y axes, for 10 minutes in each axis in each axis  
6 Post-Vibration Test Post Thermal (Final) Vibration: 0.04g2/Hz for 5 minute in each of the 3 axes   Active testing
7 Endurance 168hrs at room temperature for sonars, communication equipment AIO systems, NAV aid equipment etc. and 08 hrs for radar equipment with 04 hrs ON The equipment/ system is to be subjected to endurance test post FATS  

4.     Summary

ESS is a process to expose defective components and workmanship defects at the manufacturing stage and avoid their occurrence in early life of the product in the field.  Though they look similar to environmental tests, they are not environmental tests which are carried out to bring out the defects due to design and engineering.

5.     References

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IMS

21-26 June 2020

IMS2020 in Los Angeles, CA 21-26 June, is world’s largest microwave and RF industry trade show, plus technical sessions, workshops and panel sessions, MicroApps sessions, and the Industry Workshops.

Meet with us at for interactive sessions with expert engineers, and to review our latest offerings, or discuss an upcoming project. We’re at booth #733.
See you there!

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Eldaas renews partnership alliance with Xilinx

Eldaas proudly announces their partnership renewal with xilinx. Eldaas assures that their contribution on FPGA based solutions are increasing in the recent past and it will be more in the future years. This partnership will play a key role in their future achievements too. Read more


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Indian trade exhibition

02-04 Mar 2020

The Indian Trade Exhibition focuses on technologies, innovations, tools, instruments, fasteners, hardware, nanotech, electricals, electronics new and renewable energy technology,and high end technologies.

We are delighted to invite you to ELDAAS Booth.Our experts would be happy to meet you at the booth and can assist you with any of your up-coming projects. Looking forward to meeting you at the event!!!

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AI-EDGE

Introduction

EDGE AI is nothing but a technological combination of two words, where AI algorithm is processed by the local host or end device as per the user requirement which has to be programmed in the predefined AI algorithm developed by the user. It is not compulsory for EDGE device to have a connection for functioning and processing of the data. The application device will perform the required operation and then it will store the data into the application device and whenever device will get internet connection it will store the data into the cloud for storage and further process. The main thing with EDGE is that it allows mission-critical and time – sensitive decisions to be made fast, more reliably and with greater security. The main reason for combining AI with EDGE is because of the growth of smart devices like smart phones, watches and sensors placed in machines and infrastructure.

EDGE Based Computing Block diagram
The major advantages of EDGE AI are as follow:
  • The data processing speed for EDGE AI-enabled devices is really fast as compared to centralized IoT models. With a processing time of less than a few milliseconds, the risk of data getting tampered during transit is very less. These devices also include enhanced security features, as some level of data privacy can be added at the device stage itself and can be sent to the cloud
  • EDGE AI gives a solution to one of the most prevailing problem – latency. Low latency and real-time insights help in building great customer experiences. The problem with latency is major thing to be taken where the delay of few milliseconds can make a big impact.
  • Let’s have a further more detailed look into latency for better understanding about how delay issues are being solved with EDGE-AI computing. As latency is a by-product of distance,One example can be taken into consideration, where under very best condition it takes data about 21 milliseconds to travel from New York to San Francisco. But this numbers are not the exact because of some other factors which includes bandwidth of the data transferred rerouting near the data endpoint can add between 10 to 65 milliseconds of latency.This is how things work when we have to directly send data to the server. If we consider this kind of topology being used for an autonomous vehicle which has to drive down any road safely, it must observe the road in real-time and stop if a person walks in front of the car. In such a case, processing visual information and making a decision with the latency of above specified time won’t be a possible thing which in turn will be a big risk for the pedestrians.

    But with the case of EDGE computing architecture the above specified risk of autonomous vehicle can be eluded to a great extend because it provides an excellent way to reduce the latency where the major decisions will be taken by the EDGE devices instead of directly sending it to the cloud, which will give us the filtered data and thereby reducing the bandwidth of the data to be transferred to the cloud in this process reducing the latency. Another advantage is that we can locally store the data into our EDGE devices; this will help the user when they won’t have the network availability to transfer the data and whenever network will be available the data can be transferred to cloud.

  • The cost savings alone can be a driver also towards deploying an edge-computing architecture
  • Another thing is the decentralization for AI as for the PCs the amount of computation power is limited that can be put into cameras, sensors or smartphones
  • Many devices that are not connected to power sources raise the problem for battery life and power dissipation. But this problem won’t arise when a decision requires massive computational power and need not take into real world
EDGE Applications
  • Surveillance and Monitoring:

Deep Learning-enabled smart cameras could locally process captured images to identify and track multiple objects and people, detecting suspicious activities directly on the edge node. These smart cameras minimize communication with the remote servers by only sending data on a triggering event, also reducing remote processing and memory requirements. Intruder monitoring for secure homes and monitoring of elderly people are typical applications.

  • Autonomous Vehicles:

A smart automotive camera or sensor can recognize vehicles, traffic signs, pedestrians, roads, and objects locally, sending only information needed to perform autonomous driving to the main controller. A similar concept can be applied to robots and drones.

  • Expression Analysis to improve shopping, advertising, or driving:

An individual’s emotional reaction can provide clues to their degree of acceptance of a service, like/dislike of various products shown on the shelves in a shop, or their level of stress, which can be used to understand and modulate the type and the amount information delivered.

  • Home Automation:

Smart homes are enabled with many smart features. Features such as mobile app unlocking system, enhanced security, control over household equipment such as refrigeration, telephone, television, computer systems, fans, and even microwave oven. These are few of the very large features of Smart Homes facilitates.

Many more EDGE based applications are available and still, research is being done in certain sectors like education systems and healthcare trying to bring out the technological improvement and opportunities for a better easy life.

Conclusion:

EDGE-AI with all sorts of benefits is going to hit the semiconductor market in a larger manner because of its advantage in many different ways which includes cheaper cost, highly responsive, better security features, low power consumption and easy to manage.

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Eldaas Technologies at DefExpo2020

The 11th edition of the Defence Expo was held at Lucknow, UP, between 5th – 9th Feb 2020.

Def Expo India, is one of the largest events of its kind in the world and it is being organized by Department of Defence Production, Ministry of Defence, India. The show was aimed at showcasing India’s defence manufacturing capabilities to the world.

In our booth, we showcased the cutting edge technology products and solutions.

We should say that the show was a grand success and we were able to meet many representatives of renowned companies who shown keen interest in our products. Defexpo 2020 is once again proved that it is an excellent platform for companies like Eldaas to showcase our capabilities in Defence Industry and explore multi-role business opportunities.

We thank the defexpo organisers, NSIC for their extended support.

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Chairman Mr.Sarma, CEO Mr.Suneel Kumar with NSIC Team @ DefExpo20
Our Chairman explaining our product portfolio to foreign delegates
Mr. Suneel & Mr. Sarma in discussion with senior defence dignitaries
Chairman Mr.Sarma with senior dignitary of Defence
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